OptiPrime-X Series

Ultra-High Resolution &
Ultra-High Sensitivity Scatterometer
with Thin Film Measurement Capabilities

The n&k OptiPrime-X series are automated metrology systems used to fully characterize and monitor Thin Film and OCD applications for both current and next generation IC processes.

Utilizing patented all-reflective optics, a broadband wavelength range (190 – 1000nm), proprietary optical formulation, and an industry leading signal-to-noise ratio, each system provides the accurate and reproducible data required to monitor subtle changes in critical device parameters (thin film thickness, optical properties, critical dimensions (CD), poly recess profile, sidewall angle) across various key applications.  The OptiPrime-X also incorporates a Single Wavelength ellipsometer to measure ellipsometric parameters at 633nm for added Thin Film Metrology capability.

High Throughput, Fully Automated
Optical Metrology System for Higher Yields;
with added 633nm Single Wavelength Ellipsometer
for additional Thin Film R&R Capability

OptiPrime-X Series General Specifications

  • Wide Wavelength Range which allows for an extensive variety of applications
  • Film Thickness and Optical Properties
  • Trench/OCD Metrology Capabilities  
  • Micro-Spot Technology
  • Configurable for all Wafer types and sizes
  • Full Automation that meets all Industry Fab and Foundry Standards
  • Easy to Maintain and Service
  • SEMI Standards and Third-Party Certifications
  • GEM/SECS Communication Interface

Thin Film & OCD Scatterometry Applications

Thin Film Application Examples

The n&k OptiPrime-X applications cover both current and next generation thin film measurement demands for R&D and Production: Ultra Thin Films and Residual Layers, Multi-Layer Stacks, Inhomogeneous Films, 193 nm and 248 nm ARCs and Resists, Low-κ Films, High-κ Films, and films deposited on practically any substrate. In addition, through the use of the SWE, the n&k OptiPrime-X offers excellent dynamic R&R results when measuring ultra-thin films.

HIGH-K GATE INSULATORS: ATOMIC LAYER DEPOSITION (ALD)
HfO2 (20 - 40 Å)
Silicon Substrate
Results of Analysis: — Bare Si, — 19.7Å HfO2 /Si, — 32.1Å HfO2 /Si, — 41.0Å HfO2 /Si
ADVANCED LITHOGRAPHY: RESIST / BARC / Si SUBSTRATE
Experimental and Calculated Reflectance Spectra
193 nm Resist = 2968 Å
193 nm BARC = 819 Å
Silicon Substrate
Results of Analysis: n and k Spectra of 193 nm BARC and Resist

Thicknesses and n and k spectra of 193 nm BARC and Resist are simultaneously determined:

Thickness Results:
193 nm Resist = 2968 Å
193 nm BARC = 819 Å

OCD Scatterometry Applications

The n&k OptiPrime-CD’s OCD scatterometry applications cover structures with very large pitches and very small pitches, 2-D and 3-D complex structures including films inside and outside of shallow and deep trenches and contact holes. Because of our patented and unique optical design, n&k Technology offers the highest signal-to-noise ratio and lowest cost of ownership to support your OCD requirement.

2-D COMPLEX STRUCTURE
n&k Results - Cross Sectional View
Si-Rich Nitride Poly-Si SiO2 SiN Si 31 nm 99 nm 11 nm 8 nm 6 nm 28 nm 67 nm 33 nm 26 nm
Experimental Spectra Showing Distinct Rs and Rp Polarized Spectra
3-D ASYMMETRIC ELLIPTICAL HOLES
n&k Results - Top View
CD (Y) CD (X)
Cross Sectional View
SiO 2 155 nm 44 nm 54 nm 123 nm SiON Pitch (X) = 300 nm, Pitch (Y) = 300 nmCD (X) = 160 nm, CD (Y) = 125 nm Si Poly-Si SiN
Experimental Spectra Showing Distinct Rs and Rp Polarized Spectra
PROFILE COMPARISON WITH FIB AND X-SEM
Cross Section
n&k Results
SiO2 on Si Trench

SOI Trench (Flared CD Bottom)

Poly Recess Trench

n&k Technology OptiPrime-X Series Markets

Our products will be your eyes on the Nano scale, to ensure your IC’s and products have the highest yields.

Advanced Packaging

In addition to having our successes in the FEOL, we have now established success in the BEOL for various Advanced Packaging processes.

Automotive

Sensors, safety features, advanced braking technology, auto-pilot driving; these technologies all require advanced Automotive IC’s.

Image Sensor

With the CMOS Image Sensor (CIS) market expected to grow significantly over the next several years, the rise in demand for image cameras for automotive, medical, and consumer goods will require high quality CIS devices.

Foundry/Logic/Memory

The foundation and building blocks of the electronics and computing industries, our products help ensure you can obtain the highest yields possible when manufacturing these integral IC’s. 

MEMS

The world of MEMS manufacturing continues to grow as sensors, actuators, microvalves, and micropumps are rapidly produced due to their stellar device performance and low-cost levels.

Power Device

Foundational in our technological eco-system in respect to electrical voltage and current flow, these devices are everywhere from the smallest consumer goods to the largest aircraft.

Specialty IC

Bridging the digital and physical worlds, Specialty IC’s supplement Logic technology, creating a new wave of technological innovation. 

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