LittleFoot Series

Ultra-High Resolution &
Ultra-High Sensitivity Scatterometer with
Thin Film Measurement Capabilities and
Reduced Footprint for 200 mm and 150 mm Wafers

The n&k LittleFoot series are automated metrology systems used to fully characterize and monitor Thin Film and OCD applications for both current and next generation IC processes. With a ~40% smaller Footprint compared to similar metrology tools, the n&k LittleFoot allows for significant savings of wafer fab space without any compromise in effectiveness.

Utilizing patented all-reflective optics, a broadband wavelength range (190 – 1000nm), proprietary optical formulation, and an industry leading signal-to-noise ratio, each system provides the accurate and reproducible data required to monitor subtle changes in critical device parameters (thin film thickness, optical properties, critical dimensions (CD), poly recess profile, sidewall angle) across various key applications.

~40% Smaller Footprint than Competing
Fully Automated Metrology Tools

LittleFoot Series General Specifications

  • Wide Wavelength Range which allows for an extensive variety of applications
  • Film Thickness and Optical Properties
  • Trench/OCD Metrology Capabilities  
  • Micro-Spot Technology
  • Configurable for all Wafer types and sizes
  • Full Automation that meets all Industry Fab and Foundry Standards
  • Easy to Maintain and Service
  • SEMI Standards and Third-Party Certifications
  • GEM/SECS Communication Interface

Thin Film & OCD Scatterometry Applications

Thin Film Application Examples

The n&k LittleFoot’s thin film applications cover both current and next generation thin film measurement demands for R&D and production: Ultra Thin Films and Residual Layers, Multi-Layer Stacks, Inhomogeneous Films, 193 nm and 248 nm ARCs and Resists, Low-κ Films, High-κ Films, and films deposited on practically any substrate.

HfO2 (20 - 40 Å)
Silicon Substrate
Results of Analysis: — Bare Si, — 19.7Å HfO2 /Si, — 32.1Å HfO2 /Si, — 41.0Å HfO2 /Si
Poly-Si (with Surface Roughness)
Silicon Substrate
SurfaceRoughness (Å) Poly-SiThickness (Å) SiO 2 Thickness (Å) Red 32 18245 505 Green 57 15078 622 Blue 85 21330 765 Spectra
Complex Multi-Layer Film Structure
65 µm Photoresist
1 µm SiNx
250 Å SiO2
15 µm Silicon
1.5 µm SiO2
Silicon Substrate

OCD Scatterometry Applications

The n&k LittleFoot-CD’s OCD scatterometry applications cover structures with very large pitches and very small pitches, 2-D and 3-D complex structures including films inside and outside of shallow and deep trenches and contact holes. Because of our patented and unique optical design, n&k Technology offers the highest signal-to-noise ratio and lowest cost of ownership to support your OCD requirement.

n&k Results - Cross Sectional View
Si-Rich Nitride Poly-Si SiO2 SiN Si 31 nm 99 nm 11 nm 8 nm 6 nm 28 nm 67 nm 33 nm 26 nm
Experimental Spectra Showing Distinct Rs and Rp Polarized Spectra
Measurement of Thin Films, Depth, Top CD and Bottom CD
Cross-Section View with Nominal Thickness
Top CD Bottom CD Trench Depth Trapezoid SiO 2 1000 Å (Fixed) SiN 500 Å (Fixed) USG 3000 Å (Fixed) Cu 2000 Å (Fixed) SiC(1) 300 Å SiC(2) 300 Å SiOC(3) 650 Å SiOC(2) 1000 Å SiOC(1) 700 Å SiO 2 300 Å
Trench Depth = 1416 ÅTop CD = 79 nmBottom CD = 61 nm SiO 2 = 252 Å SiOC (1) = 404 Å SiOC (2) = 760 Å SiOC (3) = 632 ÅSiC (2) = 290 ÅSiC (1) = 295 Å Thickness Results: OCD Results:
Cross Section
n&k Results
SiO2 on Si Trench

SOI Trench (Flared CD Bottom)

Poly Recess Trench

n&k Technology LittleFoot Series Markets

Our products will be your eyes on the Nano scale, to ensure your IC’s and products have the highest yields.

Advanced Packaging

In addition to having our successes in the FEOL, we have now established success in the BEOL for various Advanced Packaging processes.


Sensors, safety features, advanced braking technology, auto-pilot driving; these technologies all require advanced Automotive IC’s.

Image Sensor

With the CMOS Image Sensor (CIS) market expected to grow significantly over the next several years, the rise in demand for image cameras for automotive, medical, and consumer goods will require high quality CIS devices.


The foundation and building blocks of the electronics and computing industries, our products help ensure you can obtain the highest yields possible when manufacturing these integral IC’s. 


The world of MEMS manufacturing continues to grow as sensors, actuators, microvalves, and micropumps are rapidly produced due to their stellar device performance and low-cost levels.

Specialty IC

Bridging the digital and physical worlds, Specialty IC’s supplement Logic technology, creating a new wave of technological innovation. 

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