Advanced Packaging

In addition to having our successes in the FEOL, we have now established success in the BEOL for various Advanced Packaging processes.  Our products will be able to help you meet your Time-to-Market and Time-to-Volume strategies.

Key Applications

  • Angstrom-resolution Thin Film control
  • Various Deposition, Etch, and CMP processes
  • Warped substrate process monitoring
  • Process control for Cu Pillar and Bumping processes such as bump heights

Products For Use in The Advanced Packaging Market

Olympian Series

The n&k Olympian Series is our flagship high-throughput DUV-Vis-IR scatterometer/thin film metrology system with micro-spot technology, covering Reflectance measurements in the wavelength range from 190nm – 15,000nm. With the inclusion of the infra-red wavelength range, the Olympian Series extends the capabilities of n&k’s OptiPrime (DUV-Vis-NIR) series, making the Olympian the most versatile optical metrology tool in the industry for monitoring Thin Film and Trench/OCD applications.

Product Details →

OptiPrime-X Series

The n&k OptiPrime-X series are high-throughput DUV-Vis-NIR scatterometers/thin film metrology systems, covering Reflectance measurements in the wavelength range from 190nm – 1000nm with micro-spot technology and a single wavelength ellipsometer at 633nm for monitoring Thin Film and Trench/OCD applications. The n&k OptiPrime-X series are field proven to meet your high-volume production needs.

Product Details →

OptiPrime Series

The n&k OptiPrime series are high-throughput DUV-Vis-NIR scatterometers/thin film metrology systems, covering Reflectance measurements in the wavelength range from 190nm – 1000nm with micro-spot technology for monitoring Thin Film and Trench/OCD applications. The n&k OptiPrime series are field proven to meet your high-volume production needs.

Product Details →
Malcare WordPress Security