Versatile Metrology for your Thin Film or Trench/OCD applications
Perfect for Research & Development sites, Labs, Universities, and Operations whereby cassette-to-cassette automation and high-volume may not be necessary. n&k has the ability and agility to manufacture a sophisticated metrology system to meet your needs and requirements. And one of the best attributes is that applications can seamlessly be transferred from a Benchtop n&k system to a Fully Automated n&k system.
Utilizing patented all-reflective optics, a broadband wavelength range (190 – 1000nm), proprietary optical formulation, and an industry leading signal-to-noise ratio, each system provides the accurate and reproducible data required to monitor subtle changes in critical device parameters (thin film thickness, optical properties, critical dimensions (CD), poly recess profile, sidewall angle) across various key applications. n&k’s Benchtop systems can also accommodate a wide variety of both opaque and transparent substrates such as Silicon, Gallium Arsenide, Silicon Carbide, Gallium Nitride, Sapphire, Glass, Quartz; in both wafer and coupon/piece formats; making the n&k Benchtop system one of the most versatile metrology tools in its class.
The n&k Benchtop System’s thin and thick film applications cover both current and next generation measurement demands for R&D and production: Ultra-Thin Films and Residual Layers, Multi-Layer Stacks, Inhomogeneous Films, 193 nm & 248 nm ARCS and Resists, Low-κ films, High-κ films, films deposited on Rough Surfaces, EPI Film Stacks, and Ultra-Thick Resists.
Experimental reflectance spectra in the IR region measured at three different locations. Low frequency interference fringes are due to BOX thickness; high frequency interference fringes are due to Si device layer thickness.
Device Layer Thickness Results (nm):
Max = 31285
Mean = 30902
Min = 30069
Std Dev = 254
Box Layer Thickness Results (nm):
Max = 1014
Mean = 985
Min = 941
Std Dev = 16.3
Experimental reflectance spectra in the IR region measured for three different Epi-Si/Si samples.
The frequency of interference fringes relates to the Epi-Si thickness.
The n&k Benchtop System’s OCD scatterometry applications cover structures with very large pitches and very small pitches, 2-D and 3-D complex structures including films inside and outside of shallow and deep trenches and contact holes. Because of our patented and unique optical design, n&k Technology offers the highest signal-to-noise ratio and lowest cost of ownership to support your OCD requirement.
SOI Trench (Flared CD Bottom)
Poly Recess Trench
In addition to having our successes in the FEOL, we have now established success in the BEOL for various Advanced Packaging processes.
Sensors, safety features, advanced braking technology, auto-pilot driving; these technologies all require advanced Automotive IC’s.
With the CMOS Image Sensor (CIS) market expected to grow significantly over the next several years, the rise in demand for image cameras for automotive, medical, and consumer goods will require high quality CIS devices.
The foundation and building blocks of the electronics and computing industries, our products help ensure you can obtain the highest yields possible when manufacturing these integral IC’s.
The world of MEMS manufacturing continues to grow as sensors, actuators, microvalves, and micropumps are rapidly produced due to their stellar device performance and low-cost levels.
Bridging the digital and physical worlds, Specialty IC’s supplement Logic technology, creating a new wave of technological innovation.
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Customer Support: service@nandk.com
n&k Technology Inc.
80 Las Colinas Lane
San Jose, CA 95119