The foundation and building blocks of the electronics and computing industries, our products help ensure you can obtain the highest yields possible when manufacturing these integral IC’s.
Key Applications
Angstrom-resolution Thin Film control for FEOL modules: Deposition, Diffusion, Lithography
Patterning, Etch and CMP control
Process monitoring for current and next generation technology nodes consisting of complex 3D structures
Trench/OCD Critical Processes such as Deep Trench, Critical Dimension, or Sidewall Angle monitoring
Various Etch Processes such as FinFET, STI, DTI, Deep Etch for 5nm and previous technology nodes
High Aspect Ratio Trench Structures (i.e. 20:1)
Products For Use in The Foundary / Logic / Memory Market
The n&k Olympian Series is our flagship high-throughput DUV-Vis-IR scatterometer/thin film metrology system with micro-spot technology, covering Reflectance measurements in the wavelength range from 190nm – 15,000nm. With the inclusion of the infra-red wavelength range, the Olympian Series extends the capabilities of n&k’s OptiPrime (DUV-Vis-NIR) series, making the Olympian the ...
The n&k OptiPrime-X series are high-throughput DUV-Vis-NIR scatterometers/thin film metrology systems, covering Reflectance measurements in the wavelength range from 190nm – 1000nm with micro-spot technology and a single wavelength ellipsometer at 633nm for monitoring Thin Film and Trench/OCD applications. The n&k OptiPrime-X series are field proven to meet your high-volume ...
The n&k OptiPrime series are high-throughput DUV-Vis-NIR scatterometers/thin film metrology systems, covering Reflectance measurements in the wavelength range from 190nm – 1000nm with micro-spot technology for monitoring Thin Film and Trench/OCD applications. The n&k OptiPrime series are field proven to meet your high-volume production needs.
The n&k OptiPrime M Benchtop Metrology System for your Thin Film or Trench/OCD applications Incorporates Reflectance-only or Reflectance and Transmittance
