Transparent or Opaque Substrates

DUV-Vis-NIR (Wavelength Range: 190nm – 1000nm) Scatterometers/
Thin Film Metrology Systems for Transparent and Opaque Substrates,
Designed for Conventional and EUV Photomasks

The n&k Gemini and Gemini-M are specifically designed for measurements of Conventional and EUV photomasks. These tools are based on polarized Reflectance (Rs and Rp) and polarized Transmittance (Ts and Tp) measurements, with a 50μm spot size for Rs, Rp, Ts, Tp. Polarized Reflectance and Polarized Transmittance are simultaneously measured to determine film thickness and n and k spectra from 190nm – 1000nm, as well as depth, CD and Profile of trenches and contact holes of Conventional and EUV photomasks.

The Gemini Series is our “next-generation” DUV-Vis-NIR Scatterometer/Thin Film series for photomasks. This series was launched in 2011, superseding the previous generation 5700-CDRT and 1700-CDRT. Advancements in the optical design of the Gemini Series provide a 50μm spot size for Ts and Tp in comparison to the 200μm spot size of previous generations.

• Measurements of all the layers of EUV masks, including:
  • – Absorber Layer
  • – Buffer Layer
  • – Cap Layer
  • – Super-Structure (alternating Mo/a-Si) Layers
• Ability to create analysis models of film stacks with 100 layers
  or more
• Ability to characterize complex materials from a multilayer film stack
• Thickness measurement sensitivity for layers <5nm
• Film Thickness and n and k spectra (190nm – 1000nm) of all the
  layers of phase shift masks including:
  • – Resist
  • – ARC
  • – CrOx
  • – Cr
  • – CrN
  • – ArF
  • – KrF
  • – MoSi
• Measurements of films that are on or lining OCD structures of masks
• Phase-shift of phase shift masks

• Measurements of Depths, CDs and Profiles of 2D (trenches) and 3D (holes) structures of Conventional, EUV and Multi-Patterning ArF
  Photomasks
• Ability to create analysis models for complex OCD structures
• Ability to measure trenches and holes with extremely small pitches (less than 30nm) and depths (less than 40nm) etched in quartz
• Quartz etch depth with Cr hard mask
• Through pellicle measurements
• Measurement of corner rounding of holes
• Correlation of Transmittance to CD for accurate and fast
  determination of CDs in production
• Highly accurate and repeatable results

Trench Array Capability Chart for the Gemini Series

Contact Hole Array Capability Chart for the Gemini Series

Due to their ability to measure a large range of OCD and thin film structures that cover current and future applications, the tools belonging to the Gemini Series are used extensively for the most challenging applications of today’s semiconductor industry.