Opaque Substrates Only

DUV-Vis-NIR (Wavelength Range: 190nm – 1000nm) Thin Film Metrology Systems for Patterned and Unpatterned Wafers:

The n&k OptiPrime-TF, OptiPrime-TF-M and n&k LittleFoot-TF are DUV-Vis-NIR thin film only metrology systems, based on unpolarized Reflectance (R) measurements from 190nm to 1000nm with microspot technology. These tools measure thickness and n and k spectra from 190nm – 1000nm of thin films on patterned and unpatterned wafers.

Analogous to their scatterometer counterparts, the OptiPrime-TF, OptiPrime-TF-M and LittleFoot-TF are our “next-generation” DUV-Vis-NIR thin film series, launched in 2012, superseding the previous generation, 7000, 3000, and 1700 Series, respectively. Advancements in the optical design of the OptiPrime-TF Series provide a smaller micro spot over the previous generation.

The n&k LittleFoot-TF is a fully automated system, with approximately 40% reduction in footprint, resulting in a significant savings in the utilization of fab space. This reduction in footprint is achieved through an innovative and patented wafer handling mechanism. The n&k Little-Foot-TF is as reliable and fast as any robot-based handing system, but at a much reduced cost.

Below are examples of measurements achieved by the OptiPrime-TF Series and Littlefoot-TF for both patterned and blanket films:

• Standard films such as SiOx, SiNx, Poly-Si, a-Si:H, SiCx,
  SiGex, a-C:H, TiNx, AlOx
• Polyresists, polymers, polyimides
• Thin metal films (less than ~ 800Å in general)
  • – Al
  • – CrSi
  • – Ta
  • – Ti
  • – W
  • – Cu
  • – Fe
  • – Au
  • – Ag
• High-k films
• Low-k films
• Chalcogenide films
• SOI
• Graphene
• Inhomogeneous films
• A variety of complex film stacks, including
  • – Multi-Layer Film Stacks with Inhomogeneous Under-Layer
  • – Multi-Layer Film Stacks with Unknown Under-Layer
  • – Ultra-Thin Films (down to a few Å), e.g., a Monolayer of Graphene
• Ultra-Thin Residual Layers
• Films Deposited on Rough Surfaces
• Films on Substrates Besides Silicon:
  • – For example: GaAs, SiC, AlTiC
• Films on rough surfaces
• Surface and interface roughness of thin films
• Energy Band Gap
• Compositon (e.g., %Ge in SiGex; %N, %H, %O in SiOxNx:H,
  %N in TiNx, etc.)
• Crystallinity (e.g., degree of crystallinity of Poly-Si or GST)

The TF Series includes a variety of tools, both manual and automatic, for a variety of wafer sizes. The table below presents the differences between the tools: